TSMC and AMKR sign 10-year advanced packaging deal in Arizona
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TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States
June 16, 2026 9:00 AM EDTHSINCHU, Taiwan & TEMPE, Ariz.--(BUSINESS WIRE)-- Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) today announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model while strengthening... More
