QTREX produces cryogenic chip carrier for quantum processor interface

QTREX Quantum Ltd. (Nasdaq: QTEX) announced it has produced a cryogenic chip carrier using its proprietary single-build additively manufactured electronics (AME) process, based on a design supplied by an unnamed major U.S.-based technology company active in quantum computing.

The Israel-based company said the chip carrier was built using a Kapton-class polyimide architecture adapted for very low-temperature environments. The single-build AME process integrates the cryogenic chip carrier and interconnect structure into one monolithic architecture, combining conductive pathways, dielectric structures, shielding features, and direct interconnect transitions without separate connectors or manual assembly steps.

A cryogenic chip carrier supports the quantum processor and manages signal routing between the processor interface and the cryogenic input/output stack. QTREX said the milestone extends its AME platform into the processor-interface layer of the quantum hardware stack.

"By enabling the cryogenic chip carrier and interconnect structure to be produced within the same single-build AME architecture, we are expanding our quantum connectivity platform to include processor-interface functions," said Dagi Ben-Noon, CEO of QTREX.

The company said the next phase is expected to focus on customer-specific cryogenic chip carrier designs tailored to individual processor architectures and system-level requirements.

QTREX plans to present the chip carrier sample during private meetings in Boston around the Quantum.Tech World 2026 conference, scheduled for June 25–26, 2026.

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