Broadcom partners with Samsung on integrated 5G and Wi-Fi 8 platform

Broadcom Inc. (NASDAQ: AVGO) announced a collaboration with Samsung Electronics Co., Ltd. on a reference platform for the fixed wireless access market that integrates Broadcom's BCM6776 Wi-Fi 8 System-on-Chip with Samsung's B1320 5G Modem.

The platform combines 3GPP Release 17 connectivity with the Wi-Fi 8 standard. The Broadcom BCM6776 is a tri-band Wi-Fi 8 SoC that includes a quad-core Arm network processor and supports 2-stream 40 MHz channels in the 2.4 GHz band and 4-stream 160 MHz channels in the 5 and 6 GHz bands. The company states the chip enables a 50% reduction in active power consumption compared to previous generations.

Samsung's B1320 is a 5nm chipset solution supporting 3GPP Release 17 with 5G downlink speeds of 3.43 Gbps and uplink speeds of 1.17 Gbps. The chipset includes a Power Class 1.5 RF transceiver, power management, and a GNSS receiver, along with support for NR-NTN and NB-NTN satellite communications.

"This platform is designed to deliver reliable performance across a wide range of environments, helping operators bring high-quality connectivity experiences to subscribers," said Joonsuk Kim, Executive Vice President and Head of CP Development at Samsung Electronics.

Vijay Nagarajan, Vice President of Marketing at Broadcom's Wireless and Broadband Communications Division, said the partnership "gives operators a tool that delivers a consistent experience to every corner of the home."

Equipment manufacturers HUMAX Networks and WNC are integrating the platform into their gateway portfolios. Global carrier trials and OEM sampling are currently underway, according to the companies' joint statement.

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