Rambus to Present at Upcoming Investor Conferences

SAN JOSE, Calif.--(BUSINESS WIRE)-- Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced that its executives will present at three upcoming investor events: the Baird 2026 Global Consumer, Technology & Services Conference; the Evercore 2026 Global TMT Conference; and the Rosenblatt 6th Annual Technology Virtual Summit.

Baird 2026 Global Consumer, Technology & Services Conference

Sumeet Gagneja, chief financial officer, and Matt Jones, senior vice president of corporate strategy, will present at the Baird 2026 Global Consumer, Technology & Services Conference in New York City, NY on Tuesday, June 2, 2026, at 9:05 a.m. ET. The presentation will be available live through a webcast that can be accessed on the Rambus Investor Relations website at investor.rambus.com. A replay of the presentation will also be available on the website following the event.

Evercore 2026 Global TMT Conference

Luc Seraphin, chief executive officer, will present at the Evercore 2026 Global TMT Conference in San Francisco, CA on Wednesday, June 3, 2026, at 2:35 p.m. PT. The presentation will be available live through a webcast that can be accessed on the Rambus Investor Relations website at investor.rambus.com. A replay of the presentation will also be available on the website following the event.

Rosenblatt 6th Annual Technology Virtual Summit

Steve Woo, fellow and distinguished inventor, will present at the Rosenblatt 6th Annual Technology Virtual Summit on Tuesday, June 9, 2026, at 2:00 p.m. PT. The presentation will be available live through a webcast that can be accessed on the Rambus Investor Relations website at investor.rambus.com. A replay of the presentation will also be available on the website following the event.

About Rambus Inc.

Rambus delivers industry-leading chips and silicon IP for the data center and AI infrastructure. With over three decades of advanced semiconductor experience, our products and technologies address the critical bottlenecks between memory and processing to accelerate data-intensive workloads. By enabling greater bandwidth, efficiency and security across next-generation computing platforms, we make data faster and safer. For more information, visit rambus.com.

Source: Rambus Inc.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260514547393/en/

Nicole Noutsios
Rambus Investor Relations
(510) 315-1003
[email protected]

Source: Rambus Inc.

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