SWEP partners with Microchannel Devices to expand heat exchanger portfolio

SWEP, a subsidiary of Dover Corporation (NYSE: DOV), announced a partnership with Italy-based Microchannel Devices to add printed circuit heat exchangers to its product lineup. The collaboration allows SWEP to offer complementary heat transfer technology alongside its existing brazed plate heat exchangers.

Under the buy-resell agreement, SWEP will distribute Microchannel Devices' printed circuit heat exchangers through its global sales network. The partnership targets applications requiring space efficiency, high working pressures, and extreme temperature conditions, particularly in hydrogen infrastructure, energy storage, and CO2 applications.

"This partnership provides SWEP access to complementary products, while MCD benefits from accelerated market reach through SWEP's global sales channels and strong customer relationships," said Ulrika Nordqvist, SWEP President.

Microchannel Devices specializes in chemical etching and produces printed circuit heat exchangers using patented diffusion bonding technology. The company provides integrated design, production, and testing capabilities for the heat transfer equipment.

SWEP operates as part of Dover's Climate & Sustainability Technologies segment and manufactures brazed plate heat exchangers for heating, ventilation, air conditioning, refrigeration, and industrial applications. The company has five production sites and operates in 50 countries with more than 1,100 employees.

Dover Corporation reported annual revenue exceeding $8 billion and employs approximately 24,000 people across five operating segments. The company is headquartered in Downers Grove, Illinois.

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