http://www.streetinsider.com Latest StreetInsider.com News Articles en-us Copyright 2026, StreetInsider.com rss@streetinsider.com (SI RSS) rss@streetinsider.com (SI RSS) Mon, 15 Jun 2026 17:35:00 -0400 http://blogs.law.harvard.edu/tech/rss http://www.streetinsider.com/images/rss_logo.gif http://www.streetinsider.com 143 28 0 1 2 3 21 22 23 Saturday Sunday http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+12++Filed+by%3A+Fortebuono+Kathleen+M./26648760.html si-local-file:///var/storage/secattach/20260615/26648760.html http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+12++Filed+by%3A+Fortebuono+Kathleen+M./26648760.html Mon, 15 Jun 2026 17:35:00 -0400 O.75393313 Q Q.WI http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+12++Filed+by%3A+Fortebuono+Kathleen+M./26648760.html si-local-file:///var/storage/secattach/20260615/26648760.html http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+12++Filed+by%3A+Fortebuono+Kathleen+M./26648760.html Mon, 15 Jun 2026 17:35:00 -0400 O.75393313 Q Q.WI http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+12++Filed+by%3A+Fortebuono+Kathleen+M./26648760.html si-local-file:///var/storage/secattach/20260615/26648760.html http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+12++Filed+by%3A+Fortebuono+Kathleen+M./26648760.html Mon, 15 Jun 2026 17:35:00 -0400 O.75393313 Q Q.WI http://www.streetinsider.com/Press+Releases/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. </p><p> A live webcast of the fireside chat will be available at <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fir.qnityelectronics.com%2Fevents-presentations%2Fevents&amp;esheet=54552768&amp;newsitemid=20260612667804&amp;lan=en-US&amp;anchor=Events+%7C+Qnity+Electronics%2C+Inc.+%28Q%29&amp;index=1&amp;md5=329956b50b4f157743fa2a3df72cb136" shape="rect">Events | Qnity Electronics, Inc. (Q)</a>. A replay of the webcast will be available following the conclusion of the event. </p><p> <b>About Qnity <br /></b>Qnity is a premier technology provider across the semiconductor http://www.streetinsider.com/Press+Releases/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html Fri, 12 Jun 2026 15:00:00 -0400 A.50216685 O.06733418 O.75393313 Q http://www.streetinsider.com/Press+Releases/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. </p><p> A live webcast of the fireside chat will be available at <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fir.qnityelectronics.com%2Fevents-presentations%2Fevents&amp;esheet=54552768&amp;newsitemid=20260612667804&amp;lan=en-US&amp;anchor=Events+%7C+Qnity+Electronics%2C+Inc.+%28Q%29&amp;index=1&amp;md5=329956b50b4f157743fa2a3df72cb136" shape="rect">Events | Qnity Electronics, Inc. (Q)</a>. A replay of the webcast will be available following the conclusion of the event. </p><p> <b>About Qnity <br /></b>Qnity is a premier technology provider across the semiconductor http://www.streetinsider.com/Press+Releases/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html Fri, 12 Jun 2026 15:00:00 -0400 A.50216685 O.06733418 O.75393313 Q http://www.streetinsider.com/Press+Releases/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. </p><p> A live webcast of the fireside chat will be available at <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fir.qnityelectronics.com%2Fevents-presentations%2Fevents&amp;esheet=54552768&amp;newsitemid=20260612667804&amp;lan=en-US&amp;anchor=Events+%7C+Qnity+Electronics%2C+Inc.+%28Q%29&amp;index=1&amp;md5=329956b50b4f157743fa2a3df72cb136" shape="rect">Events | Qnity Electronics, Inc. (Q)</a>. A replay of the webcast will be available following the conclusion of the event. </p><p> <b>About Qnity <br /></b>Qnity is a premier technology provider across the semiconductor http://www.streetinsider.com/Press+Releases/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html Fri, 12 Jun 2026 15:00:00 -0400 A.50216685 O.06733418 O.75393313 Q http://www.streetinsider.com/Press+Releases/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. </p><p> A live webcast of the fireside chat will be available at <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fir.qnityelectronics.com%2Fevents-presentations%2Fevents&amp;esheet=54552768&amp;newsitemid=20260612667804&amp;lan=en-US&amp;anchor=Events+%7C+Qnity+Electronics%2C+Inc.+%28Q%29&amp;index=1&amp;md5=329956b50b4f157743fa2a3df72cb136" shape="rect">Events | Qnity Electronics, Inc. (Q)</a>. A replay of the webcast will be available following the conclusion of the event. </p><p> <b>About Qnity <br /></b>Qnity is a premier technology provider across the semiconductor http://www.streetinsider.com/Press+Releases/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html Fri, 12 Jun 2026 15:00:00 -0400 A.50216685 O.06733418 O.75393313 Q http://www.streetinsider.com/Business+Wire/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. </p><p> A live webcast of the fireside chat will be available at <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fir.qnityelectronics.com%2Fevents-presentations%2Fevents&amp;esheet=54552768&amp;newsitemid=20260612667804&amp;lan=en-US&amp;anchor=Events+%7C+Qnity+Electronics%2C+Inc.+%28Q%29&amp;index=1&amp;md5=329956b50b4f157743fa2a3df72cb136" shape="rect">Events | Qnity Electronics, Inc. (Q)</a>. A replay of the webcast will be available following the conclusion of the event. </p><p> <b>About Qnity <br /></b>Qnity is a premier technology provider across the semiconductor http://www.streetinsider.com/Business+Wire/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html Fri, 12 Jun 2026 15:00:00 -0400 A.50216685 O.06733418 O.75393313 Q http://www.streetinsider.com/Business+Wire/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. </p><p> A live webcast of the fireside chat will be available at <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fir.qnityelectronics.com%2Fevents-presentations%2Fevents&amp;esheet=54552768&amp;newsitemid=20260612667804&amp;lan=en-US&amp;anchor=Events+%7C+Qnity+Electronics%2C+Inc.+%28Q%29&amp;index=1&amp;md5=329956b50b4f157743fa2a3df72cb136" shape="rect">Events | Qnity Electronics, Inc. (Q)</a>. A replay of the webcast will be available following the conclusion of the event. </p><p> <b>About Qnity <br /></b>Qnity is a premier technology provider across the semiconductor http://www.streetinsider.com/Business+Wire/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html Fri, 12 Jun 2026 15:00:00 -0400 A.50216685 O.06733418 O.75393313 Q http://www.streetinsider.com/Business+Wire/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. </p><p> A live webcast of the fireside chat will be available at <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fir.qnityelectronics.com%2Fevents-presentations%2Fevents&amp;esheet=54552768&amp;newsitemid=20260612667804&amp;lan=en-US&amp;anchor=Events+%7C+Qnity+Electronics%2C+Inc.+%28Q%29&amp;index=1&amp;md5=329956b50b4f157743fa2a3df72cb136" shape="rect">Events | Qnity Electronics, Inc. (Q)</a>. A replay of the webcast will be available following the conclusion of the event. </p><p> <b>About Qnity <br /></b>Qnity is a premier technology provider across the semiconductor http://www.streetinsider.com/Business+Wire/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html Fri, 12 Jun 2026 15:00:00 -0400 A.50216685 O.06733418 O.75393313 Q http://www.streetinsider.com/Business+Wire/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. </p><p> A live webcast of the fireside chat will be available at <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fir.qnityelectronics.com%2Fevents-presentations%2Fevents&amp;esheet=54552768&amp;newsitemid=20260612667804&amp;lan=en-US&amp;anchor=Events+%7C+Qnity+Electronics%2C+Inc.+%28Q%29&amp;index=1&amp;md5=329956b50b4f157743fa2a3df72cb136" shape="rect">Events | Qnity Electronics, Inc. (Q)</a>. A replay of the webcast will be available following the conclusion of the event. </p><p> <b>About Qnity <br /></b>Qnity is a premier technology provider across the semiconductor http://www.streetinsider.com/Business+Wire/Qnity+to+Present+at+the+Wolfe+Research+Materials+of+the+Future+Conference/26640259.html Fri, 12 Jun 2026 15:00:00 -0400 A.50216685 O.06733418 O.75393313 Q http://www.streetinsider.com/Corporate+News/Qnity+introduces+Optivision+Max+CMP+pads+for+semiconductor+manufacturing/26627682.html <p>Qnity Electronics Inc. (NYSE: Q) announced the launch of its Optivision Max chemical mechanical planarization pad family for semiconductor manufacturing applications. The company said the new CMP pads are designed to support advanced semiconductor nodes and device architectures.</p><p>The Optivision Max pads build on Qnity's existing Optivision CMP pad family and offer improved defect control and extended pad lifetime, according to the company. The pads are intended to support higher yield and process efficiency in semiconductor manufacturing operations.</p><p>"Advanced nodes and evolving device architectures are driving new levels of complexity across semiconductor manufacturing," said Sanjay Kotha, VP and General Manager of CMP http://www.streetinsider.com/Corporate+News/Qnity+introduces+Optivision+Max+CMP+pads+for+semiconductor+manufacturing/26627682.html Wed, 10 Jun 2026 09:01:35 -0400 Q http://www.streetinsider.com/Press+Releases/Qnity+Launches+Optivision%E2%84%A2+Max+CMP+Pad+Family+to+Enable+Next-Generation+Semiconductor+Manufacturing/26627581.html <p class="bwalignc"> <i>Enabling yield and process improvements across advanced nodes and device architectures</i> </p> <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.qnityelectronics.com%2Fproducts%2Foptivision-max-soft-pad-series.html&amp;esheet=54550821&amp;newsitemid=20260610353747&amp;lan=en-US&amp;anchor=Optivision%26%238482%3B+Max+polishing+pads&amp;index=1&amp;md5=678fe0a52e06c6db83e75797ea797982" shape="rect">Optivision™ Max polishing pads</a>. </p><p id="news-body-cta">This press release features multimedia. View the full release here: <a target="_blank" href="https://www.businesswire.com/news/home/20260610353747/en/" rel="nofollow">https://www.businesswire.com/news/home/20260610353747/en/</a></p><div id="bwbodyimg" style="width: 480px; float:left; padding-left:0px; padding-right:20px; padding-top:0px; padding-bottom:0px;"><img src="https://mms.businesswire.com/media/20260610353747/en/2827976/4/54550821-pic.jpg" alt="A technician installs an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing &amp; http://www.streetinsider.com/Press+Releases/Qnity+Launches+Optivision%E2%84%A2+Max+CMP+Pad+Family+to+Enable+Next-Generation+Semiconductor+Manufacturing/26627581.html Wed, 10 Jun 2026 09:00:00 -0400 O.75393313 Q http://www.streetinsider.com/Press+Releases/Qnity+Launches+Optivision%E2%84%A2+Max+CMP+Pad+Family+to+Enable+Next-Generation+Semiconductor+Manufacturing/26627581.html <p class="bwalignc"> <i>Enabling yield and process improvements across advanced nodes and device architectures</i> </p> <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.qnityelectronics.com%2Fproducts%2Foptivision-max-soft-pad-series.html&amp;esheet=54550821&amp;newsitemid=20260610353747&amp;lan=en-US&amp;anchor=Optivision%26%238482%3B+Max+polishing+pads&amp;index=1&amp;md5=678fe0a52e06c6db83e75797ea797982" shape="rect">Optivision™ Max polishing pads</a>. </p><p id="news-body-cta">This press release features multimedia. View the full release here: <a target="_blank" href="https://www.businesswire.com/news/home/20260610353747/en/" rel="nofollow">https://www.businesswire.com/news/home/20260610353747/en/</a></p><div id="bwbodyimg" style="width: 480px; float:left; padding-left:0px; padding-right:20px; padding-top:0px; padding-bottom:0px;"><img src="https://mms.businesswire.com/media/20260610353747/en/2827976/4/54550821-pic.jpg" alt="A technician installs an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing &amp; http://www.streetinsider.com/Press+Releases/Qnity+Launches+Optivision%E2%84%A2+Max+CMP+Pad+Family+to+Enable+Next-Generation+Semiconductor+Manufacturing/26627581.html Wed, 10 Jun 2026 09:00:00 -0400 O.75393313 Q http://www.streetinsider.com/Business+Wire/Qnity+Launches+Optivision%E2%84%A2+Max+CMP+Pad+Family+to+Enable+Next-Generation+Semiconductor+Manufacturing/26627581.html <p class="bwalignc"> <i>Enabling yield and process improvements across advanced nodes and device architectures</i> </p> <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.qnityelectronics.com%2Fproducts%2Foptivision-max-soft-pad-series.html&amp;esheet=54550821&amp;newsitemid=20260610353747&amp;lan=en-US&amp;anchor=Optivision%26%238482%3B+Max+polishing+pads&amp;index=1&amp;md5=678fe0a52e06c6db83e75797ea797982" shape="rect">Optivision™ Max polishing pads</a>. </p><p id="news-body-cta">This press release features multimedia. View the full release here: <a target="_blank" href="https://www.businesswire.com/news/home/20260610353747/en/" rel="nofollow">https://www.businesswire.com/news/home/20260610353747/en/</a></p><div id="bwbodyimg" style="width: 480px; float:left; padding-left:0px; padding-right:20px; padding-top:0px; padding-bottom:0px;"><img src="https://mms.businesswire.com/media/20260610353747/en/2827976/4/54550821-pic.jpg" alt="A technician installs an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing &amp; http://www.streetinsider.com/Business+Wire/Qnity+Launches+Optivision%E2%84%A2+Max+CMP+Pad+Family+to+Enable+Next-Generation+Semiconductor+Manufacturing/26627581.html Wed, 10 Jun 2026 09:00:00 -0400 O.75393313 Q http://www.streetinsider.com/Business+Wire/Qnity+Launches+Optivision%E2%84%A2+Max+CMP+Pad+Family+to+Enable+Next-Generation+Semiconductor+Manufacturing/26627581.html <p class="bwalignc"> <i>Enabling yield and process improvements across advanced nodes and device architectures</i> </p> <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of <a target="_blank" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.qnityelectronics.com%2Fproducts%2Foptivision-max-soft-pad-series.html&amp;esheet=54550821&amp;newsitemid=20260610353747&amp;lan=en-US&amp;anchor=Optivision%26%238482%3B+Max+polishing+pads&amp;index=1&amp;md5=678fe0a52e06c6db83e75797ea797982" shape="rect">Optivision™ Max polishing pads</a>. </p><p id="news-body-cta">This press release features multimedia. View the full release here: <a target="_blank" href="https://www.businesswire.com/news/home/20260610353747/en/" rel="nofollow">https://www.businesswire.com/news/home/20260610353747/en/</a></p><div id="bwbodyimg" style="width: 480px; float:left; padding-left:0px; padding-right:20px; padding-top:0px; padding-bottom:0px;"><img src="https://mms.businesswire.com/media/20260610353747/en/2827976/4/54550821-pic.jpg" alt="A technician installs an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing &amp; http://www.streetinsider.com/Business+Wire/Qnity+Launches+Optivision%E2%84%A2+Max+CMP+Pad+Family+to+Enable+Next-Generation+Semiconductor+Manufacturing/26627581.html Wed, 10 Jun 2026 09:00:00 -0400 O.75393313 Q http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+05++Filed+by%3A+Sterin+Steven/26618343.html si-local-file:///var/storage/secattach/20260608/26618343.html http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+05++Filed+by%3A+Sterin+Steven/26618343.html Mon, 08 Jun 2026 17:14:00 -0400 O.75393313 Q Q.WI http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+05++Filed+by%3A+Sterin+Steven/26618343.html si-local-file:///var/storage/secattach/20260608/26618343.html http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+05++Filed+by%3A+Sterin+Steven/26618343.html Mon, 08 Jun 2026 17:14:00 -0400 O.75393313 Q Q.WI http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+05++Filed+by%3A+Sterin+Steven/26618343.html si-local-file:///var/storage/secattach/20260608/26618343.html http://www.streetinsider.com/SEC+Filings/Form++4++++++++++Qnity+Electronics%2C+Inc.+++For%3A+Jun+05++Filed+by%3A+Sterin+Steven/26618343.html Mon, 08 Jun 2026 17:14:00 -0400 O.75393313 Q Q.WI http://www.streetinsider.com/Corporate+News/Qnity+launches+advanced+packaging+materials+for+organic+interposers/26617520.html <p>Qnity Electronics Inc. (NYSE: Q) announced the introduction of two advanced packaging materials designed for organic interposer applications. The company released Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric materials.</p><p>The Intervia 8540HSP copper targets AI-driven GPU applications, providing metallization for micro-bump and copper redistribution layer applications. The material offers controlled surface variation and high-purity copper deposition for fine-pitch interconnect formation in semiconductor devices.</p><p>The Cyclotene DF6800M serves as a dry film dielectric for glass core substrates and glass interposers. The material supports fine-feature patterning and multilayer build-up processes for semiconductor manufacturing through its photo-imageable, aqueous-developed chemistry.</p><p>"AI is fundamentally http://www.streetinsider.com/Corporate+News/Qnity+launches+advanced+packaging+materials+for+organic+interposers/26617520.html Mon, 08 Jun 2026 16:15:39 -0400 Q http://www.streetinsider.com/Press+Releases/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. </p><p> “AI is fundamentally changing how chips are packaged—and materials have to evolve just as fast,” said Chuck Xu, President of Interconnect Solutions at Qnity. “As architectures move from shrinking to stacking, we’re focused on enabling that shift with advanced http://www.streetinsider.com/Press+Releases/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html Mon, 08 Jun 2026 16:15:00 -0400 A.34641108 O.00189249 O.75393313 Q http://www.streetinsider.com/Press+Releases/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. </p><p> “AI is fundamentally changing how chips are packaged—and materials have to evolve just as fast,” said Chuck Xu, President of Interconnect Solutions at Qnity. “As architectures move from shrinking to stacking, we’re focused on enabling that shift with advanced http://www.streetinsider.com/Press+Releases/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html Mon, 08 Jun 2026 16:15:00 -0400 A.34641108 O.00189249 O.75393313 Q http://www.streetinsider.com/Press+Releases/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. </p><p> “AI is fundamentally changing how chips are packaged—and materials have to evolve just as fast,” said Chuck Xu, President of Interconnect Solutions at Qnity. “As architectures move from shrinking to stacking, we’re focused on enabling that shift with advanced http://www.streetinsider.com/Press+Releases/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html Mon, 08 Jun 2026 16:15:00 -0400 A.34641108 O.00189249 O.75393313 Q http://www.streetinsider.com/Press+Releases/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. </p><p> “AI is fundamentally changing how chips are packaged—and materials have to evolve just as fast,” said Chuck Xu, President of Interconnect Solutions at Qnity. “As architectures move from shrinking to stacking, we’re focused on enabling that shift with advanced http://www.streetinsider.com/Press+Releases/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html Mon, 08 Jun 2026 16:15:00 -0400 A.34641108 O.00189249 O.75393313 Q http://www.streetinsider.com/Business+Wire/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html <p> WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. </p><p> “AI is fundamentally changing how chips are packaged—and materials have to evolve just as fast,” said Chuck Xu, President of Interconnect Solutions at Qnity. “As architectures move from shrinking to stacking, we’re focused on enabling that shift with advanced http://www.streetinsider.com/Business+Wire/Qnity+Introduces+Enhanced+Advanced+Packaging+Materials+for+Organic+Interposer+Applications/26617496.html Mon, 08 Jun 2026 16:15:00 -0400 A.34641108 O.00189249 O.75393313 Q