Teledyne Technologies Incorporated (NYSE: TDY) will demonstrate its RF and microwave capabilities at the International Microwave Symposium from June 9 to 11 in Boston. The company will display products spanning semiconductors, components, modules, interconnects, signal switching, and thermal imaging at Booth 19076.

Live demonstrations will include the TSA-220060 3U VPX Multichannel Converter, featuring dual wideband transceivers with 0.5-20 GHz coverage and integrated local oscillator generation. The company will also demonstrate non-uniform sampling technology via the EV10AS940 12.8 GSps ADC for real-time signal detection and demodulation with reduced data throughput.

Additional demonstrations will feature high-performance cables, connectors, and board-mount interconnects tested with the WavePulser 40iX Interconnect Analyzer for signal integrity analysis up to 40 GHz. Real-time thermal imaging technology for temperature mapping and component monitoring will also be showcased.

The booth will display Teledyne's broader portfolio including space and defense components, precision switching solutions, rapid prototyping capabilities, and sensing technologies. The company's Phobos and Deimos ESM solutions will be among the complete systems featured.

"What sets Teledyne apart is our ability to solve complex customer challenges across the full RF chain," said Mark Kotilinek, President of Teledyne Defense Electronics. "Built on decades of expertise, our extensive portfolio, from component-level offerings to complete systems like our Phobos and Deimos ESM solutions, continues to evolve to deliver the performance required for mission-critical applications."

Technical experts will be available throughout the symposium to discuss demonstrations, system requirements, and application-specific solutions for communications, electronic warfare, and radar systems.