Teledyne FLIR OEM announced the release of the Boson SX8, an uncooled longwave infrared thermal camera module that combines 8-micron pixel pitch with 1280 × 1024 resolution. The company states this is the first NDAA-compliant, volume production thermal camera module with these specifications.

The Boson SX8 offers four times the resolution of current high-volume VGA thermal camera modules while maintaining a similar compact size. The module features a 55% reduction in pixel area compared to standard 12-micron LWIR pixel formats, according to the company.

Teledyne FLIR OEM also introduced the Boson SX8-CZ 15–75, which includes a factory-integrated 5x continuous-zoom lens with a 15-75 mm range. The integrated system provides focus-through-zoom capabilities and thermal gradient compensation.

"By reducing pixel area by 55% compared to the standard 12-micron LWIR pixel format, Boson SX8 represents a transformational moment for thermal imaging," said Paul Clayton, President of Teledyne FLIR OEM.

The modules are manufactured in the United States and designed for applications including uncrewed aircraft systems, counter-UAS, perimeter security, handheld devices, and intelligence surveillance systems. Both products are ITAR-free and intended for defense and industrial applications with size, weight, and power constraints.

Teledyne FLIR OEM is part of Teledyne Technologies Incorporated (NYSE: TDY). The company will demonstrate the Boson SX8 product family at Eurosatory 2026 in Paris.