Teradyne Inc. (NASDAQ: TER) announced an integrated test cell solution for screening devices used in AI and data center applications, developed in collaboration with Tokyo Electron. The solution combines Teradyne's UltraFLEXplus platform with Tokyo Electron's Prexa SDP prober to provide known good device screening for advanced 2.5D and 3D packages.

The joint solution addresses challenges in chiplet-based designs where multiple die are integrated into a single package. A single defective die can compromise the entire package, making device screening necessary to protect yield and improve quality.

The test cell coordinates Teradyne's UltraFLEXplus instruments with Tokyo Electron's Prexa SDP, which maintains device temperature and manages high-power dissipation characteristics of AI silicon. The solution is built on an open ecosystem architecture that provides flexibility across probe cards, manipulators, and interface technologies.

"AI device innovation is moving at an unprecedented speed, and our customers need dependable screening at every stage of advanced packaging," said Shannon Poulin, president of the Semiconductor Test Group at Teradyne. "TEL's industry-leading Prexa SDP, combined with Teradyne's UltraFLEXplus, gives customers a production-ready solution that covers singulated device testing with the thermal precision, power density, and digital performance that today's AI and data center devices require."

The commercially available solution targets fabless designers, foundries, and outsourced semiconductor assembly and test companies. Both companies will showcase the solution at SWTest, scheduled for June 8-10, 2026, at the Omni La Costa Resort in Carlsbad, California.

Information in this article is based on a company press release.