Broadcom Inc. (NASDAQ: AVGO) announced three new semiconductor products designed to bring Wi-Fi 8 technology to mass market broadband applications. The company released the BCM68565 PON gateway system-on-chip and two dual-band Wi-Fi 8 radio chips, the BCM67142 and BCM67192.

The BCM68565 features an integrated 10-gigabit fiber WAN interface supporting XGSPON, GPON, and Active Ethernet modes. The chip includes a high-performance CPU complex with support for open source middleware including RDK and prplWare, along with integrated multi-gigabit and gigabit Ethernet PHYs.

The BCM67142 and BCM67192 integrate 2.4-GHz and 5-GHz radio functionality into single chips, building on earlier BCM6714 and BCM6719 models. Both chips include on-chip 2.4-GHz power amplifiers and hardware offload engines designed to reduce host CPU loading. The third-generation digital pre-distortion technology reduces peak power consumption by 25%.

"With our latest Wi-Fi 8 and PON products, Broadcom is making 'Ultra-High Reliability' accessible in hyper-competitive broadband markets," said Mark Gonikberg, senior vice president and general manager of Broadcom's Wireless and Broadband Communications Division.

The company stated that combining the dual-band radio integration reduces bill of materials costs, simplifies board design, and lowers power consumption compared to separate radio implementations.

Broadcom is currently sampling all three chips to early access customers and partners. The announcement represents the company's fourth wave of Wi-Fi 8 chip releases, following earlier residential and enterprise platform launches.

The products target fiber-based broadband operators seeking to deploy Wi-Fi 8 technology in cost-sensitive mass market segments while maintaining multi-gigabit performance capabilities.