Amtech Systems announces underwritten public stock offering

Amtech Systems Inc. (NASDAQ: ASYS) announced it is commencing an underwritten public offering of common stock shares. The semiconductor equipment manufacturer stated the offering is subject to market conditions with no assurance regarding completion, timing, size or terms.

The company plans to use net proceeds to accelerate growth across its semiconductor packaging and advanced wafer substrate fabrication platforms, pursue merger and acquisition opportunities, and fund working capital and general corporate purposes.

Titan Partners, a division of American Capital Partners, will serve as the sole bookrunner for the proposed offering. The offering is being conducted under a shelf registration statement on Form S-3 filed with the Securities and Exchange Commission on March 13, 2026, and declared effective on March 23, 2026.

Amtech manufactures equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication. The company's products are used to fabricate and package semiconductor devices including graphics processing units for AI applications, silicon carbide and silicon power devices, and other optical, analog and digital devices.

The company sells its products to semiconductor device packaging, electronic assembly and device fabrication companies worldwide, particularly in Asia, North America and Europe.

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