UMC launches 55nm BCD platform for power management chips

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) announced the release of its 55nm Bipolar-CMOS-DMOS platform for power management applications in smartphones, consumer electronics, automotive, and industrial devices.

The Taiwan-based semiconductor foundry stated the platform combines analog, digital, and power functions on a single chip while delivering reduced chip area, lower power consumption, and improved noise reduction compared to previous generations.

The 55nm BCD platform includes three process variants. The Non-Epitaxy process targets mobile and consumer devices with cost-effective power efficiency. The Epitaxy process meets AEC-Q100 Grade 0 automotive standards and supports operating voltages up to 150V for automotive applications. The Silicon-on-Insulator process complies with AEC-Q100 Grade 1 automotive standards and provides enhanced noise reduction for automotive and industrial uses.

The platform integrates ultra-thick metal, embedded flash, and resistive random-access memory technologies. UMC indicated these additions enhance performance and functionality for power circuit designs.

"The readiness of our 55nm BCD platform marks a major milestone for UMC, rounding out our specialty BCD technology portfolio and boosting our competitiveness in the power management market," said Steven Hsu, Vice President of Technology Development at UMC.

UMC now offers BCD technology across process nodes from 0.35µm to 55nm. The company operates 12 fabrication facilities with combined monthly capacity exceeding 400,000 wafers on a 12-inch equivalent basis. All facilities maintain IATF 16949 automotive quality certification.

The information is based on a company press release.

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